乐天堂使用恒久积淀的FA研发、生产履历,开发了应用于种种特殊应用场景的FA
功效形貌
1.阻止芯片耦合历程中FA盖板干预,乐天堂开发了无盖板FA
2.乐天堂拥有optek 3500 CO2激光光纤切割刀,使用激光切割平台开发了光纤伸出FA,角度0~45°,伸出量50~300um
3.通过对产品工艺和原质料的严酷控制,乐天堂开发了应用于Reflow情形的FA,耐受温度200~260℃
产品参数
产品应用
此类产品主要应用于硅光领域,用于芯片耦合
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